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Aromatic substituted urea 3,3'-(4-Methyl-1,3-Phenylene)Bis(1,1-Dimethylurea) bi-functional micronized latent accelerator use for the dicyandiamide cure of epoxy resins
| Place of Origin | China |
|---|---|
| Brand Name | N/A |
| Certification | COA TDS |
| Model Number | U500-21 |
| Document | TDS of U500-21 Accelerator.pdf |
| Minimum Order Quantity | 1kg |
| Price | USD1-100/kg |
| Packaging Details | 1kg/bag, 20kg or 25kg/drum |
| Delivery Time | 5-8 working days |
| Payment Terms | T/T, L/C, D/A, D/P, Western Union |
| Supply Ability | 4000kg/month |
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xProduct Details
| Chemical Name | 3,3'-(4-Methyl-1,3-Phenylene)Bis(1,1-Dimethylurea) | Item Name | U500-21 |
|---|---|---|---|
| CAS | 17526-94-2 | Synonyms | U-24M, UR500, Substituted Urea Accelerator, Bi-functional Latent Accelerator, Epoxy Resin Hardener |
| Appearance | White Powder | Purity | ≥ 95.0% |
| Melting Point | Min. 180℃ | Particle Size (98%) | Max. 10 µm |
| Application | Hardener And Accelerator Of Epoxy Resin, Adhesives, Powder Coatings, Prepregs, Encapsulation, Reinforcements | ||
| Highlight | Aromatic substituted urea,bi-functional micronized latent accelerator |
||
Product Description
Aromatic substituted urea 3,3'-(4-Methyl-1,3-Phenylene)Bis(1,1-Dimethylurea) bi-functional micronized latent accelerator
Specification of Aromatic substituted urea 3,3'-(4-Methyl-1,3-Phenylene)Bis(1,1-Dimethylurea) bi-functional micronized latent accelerator
| CAS | 17526-94-2 |
| Color | white powder |
| Purity | ≥95.0% |
| MF | C13H20N4O2 |
| MW | 264.32 |
| Application | Substituted urea accelerator, Bi-functional latent accelerator, Epoxy Resin hardener,
Laminates for electrical circuit boards, Powder coatings, Adhesives,High-tech carbon fibre composites |
Description of Aromatic substituted urea 3,3'-(4-Methyl-1,3-Phenylene)Bis(1,1-Dimethylurea) bi-functional micronized latent accelerator
U500-21 represents a bi-functional, micronized accelerator based on a substituted urea. Being a highly active as well as a latent accelerator, its prominent use is preferably in combination with the highly latent curing agents of the Dicyandiamide in thermosetting epoxy resin formulations.
As U500-21 does not contain halogens it may be preferred for applications where halogen-free formulations are required. In addition, U500-21 is not considered as a dangerous chemical substance, therefore its use under environmental aspects makes this accelerator extremely advantageous in terms of product handling and processing.
In formulations based on liquid bisphenol A epoxy resins (EEW 182-192) and micronized dicyandiamide, U500-21 is typically added in amounts of less than 5 parts per 100 parts of epoxy resin. The optimal ratio strongly depends on the specific application and process requirements and has to be determined individually for each case.
Its good latency properties make U500-21 ideal for storage-stable one-component formulations. Depending on fillers, modifiers and storage temperature, a shelf life of up to 2 months at room temperature may be obtained.
Compared to many other urea type accelerators, U500-21 shows a superior acceleration performance. Curing is possible at temperatures as low as 80°C.
Being a bi-functional uron, U500-21 is able to cure liquid epoxy resins without the use of dicyandiamide curing agents. In mixing ratios of less than 10%, U500-21 cures at temperatures from 80°C to120°C forming dense polymer networks which show normal to slightly “flexible” mechanical properties. In addition, formulations with U500-21 as a curing agent show very favorable enthalpy developments during the curing process. Therefore U500-21 is especially suited for thick layered glass or carbon fiber laminates.
Advantages of Aromatic substituted urea 3,3'-(4-Methyl-1,3-Phenylene)Bis(1,1-Dimethylurea) bi-functional micronized latent accelerator
Shows one of the highest reactivity amongst the Dicyandiamide series
Although very reactive, latencies of 2months (at 23°C) are achievable
Low in toxicity, not corrosive, not skin irritant
Can be used as accelerator and curing agent
Moderates enthalpy development in curing processes when used as sole curing agent.
U500-21 is widely used as accelerator to activate dicyandiamide curing agents in various single component thermosetting epoxy resin formulations for:Composites based on prepregs e.g., in wind energy, automotive, machinery and aerospace industry
Encapsulation compounds in the electronic industry
Reinforcements in the automotive industry
U500-21 is used as a sole curing agent in one-component the thermosetting epoxy resin formulations for:
Composites based on prepregs with low enthalpy development
Laminates in thick layers
U500-21 is classified as low toxic and has neither primary skin nor eye irritant properties. Nevertheless, being a fine powder, precautions for dust must be observed. For additional health and safety information, please refer to the actual Material Safety Data sheet.
FAQ
Q1: What is your regular lead time for sample and official order?
A1: Sample lead time 5-7 days. Official order lead time 14-21 days.
Q2: What is your MOQ?
A2: MOQ usually is 1kg.
Q3: How you control product quality?
A3: From raw material inspection, dupro inspection to final product inspection are executed strictly.
Q4: What is your warranty policy?
A4: We will send you a new batch if there is any quality issue during warranty time
Q5: Do you refund if customer receive defective product and do not accept replacement?
A5: Yes
Item Photo
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